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TR7007Q Plus SPI sMT machine Pre Owned 3D Solder Paste Inspection

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TR7007Q Plus SPI sMT machine Pre Owned 3D Solder Paste Inspection

Brand Name : TRI

Model Number : TR7007Q Plus

Place of Origin : China

MOQ : 1 unit

Price : USD

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram, Paypal

Supply Ability : 10 units

Delivery Time : 1 to 5 working days

Packaging Details : Wooden Box

Application : Solder Paste Optical Inspection (SPI)

Machine Description : 3D Solder Paste Inspection Machine

Brand : TRI

Model : TR7007Q Plus

Features : Enhanced 2D Lighting, for higher uniformity inspection.

Condition : Pre-owned

Functionality : Industrial use - SMT Assembly Line

Packaging : Wooden Box/Crate

Lead Time : 5 to 7 working days

Payment : TT, L/C, D/A, D/P, Western Union, MoneyGram, Paypal

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TR7007Q Plus SPI SMT Machine Pre Owned 3D Solder Paste Inspection

TR7007Q Plus High-Resolution Shadow Free 3D SPI with Enhanced 2D Lighting, for higher uniformity inspection, Pre-owned 3D Solder Paste Inspection (SPI) Machine

The TR7007Q Plus 3D SPI platform is equipped with an improved motion controller (EtherCAT) and an enhanced 2D lighting module. The TR7007Q Plus can accurately inspect low solder bridges and compensate for board warpage for eliminating local PCB deformation. The TR7007Q Plus is equipped with up to 4 projectors to ensure a shadow-free inspection. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.

Features:

• Enhanced 2D Lighting, for higher uniformity inspection.
• New motion controller, EtherCAT, for real-time measurements.
• Smart Factory solution with Real-time SPC Trends
• Closed Loop Ready: Feedback and Feedforward Capabilities

Specifications:

Optical System

Imaging Method	Stop-and-Go Imaging
Camera	4 Mpix or 12 Mpix (factory setting)
Imaging Resolution	5.5 μm, 6 μm, 10 μm , 15 µm (factory setting)
Lighting	Enhanced 2D Lights (RGB+W)
3D Technology	4-way Digital Fringe Pattern
Field of View	4 MP Camera Link- @ 10 μm: 20.3x20.3 mm @ 15 μm: 30.5x30.5 mm 12 MP Camera Link- @ 5.5 μm: 22.5x16.5 mm @ 10 μm: 40.8x30.7 mm @ 15 μm: 61.2x46.1 mm 12 MP CoaXPress- @ 6 μm: 24.4x18.4 mm @ 10 μm: 40.8x30.7 mm Note: (1) TR7007Q Plus DL is not available for 5.5 μm with 12 MP Camera Link and 6 μm with 12 MP CoaXPress (2) The only configuration available for the TR7007LQ Plus is 6 μm with 12 MP CoaXPress

Inspection Performance

Imaging Speed	4 MP Camera Link: Up to 3 FOV/sec 12 MP Camera Link: Up to 1.8 FOV/sec 12 MP CoaXPress: Up to 2.6 FOV/sec
Height Resolution	@10 μm/15 μm: 0.45 μm @5.5 μm/6 μm: 0.22 μm
Max. Solder Height	@10 μm/15 μm: 420 μm/750 μm @5.5 μm/6 μm: 210 μm/310 μm * on Calibration Target

Motion Table & Control

X-Axis Control	Ballscrew + EtherCAT motion controller
Y-Axis Control	Ballscrew + EtherCAT motion controller
Z-Axis Control	Ballscrew + EtherCAT motion controller
X-Y Axis Resolution	0.5 μm
Z-Axis Resolution	1 μm

Board Handling

Max PCB Size	TR7007Q Plus: @5.5 & 6 μm - 400 x 330 mm, @10 & 15 μm - 510 x 460 mm TR7007Q Plus DL: @10 & 15 μm - 510 x 310 mm x 2 Lanes, 510 x 590 mm x 1 Lane TR7007LQ Plus: @6 μm - 765 x 610 mm
PCB Thickness	0.6 - 5mm
Max PCB Weight	3kg. Optional: 5kg
Top Clearance	@5.5 μm, 6 μm: 25 mm; @10 μm, 15 μm: 50 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm
Conveyor Height	880 – 920 mm * SMEMA Compatible

Inspection Functions

Defects	Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging
Measurement	Height Area Volume Offset

Dimensions

WxDxH	TR7007Q Plus: 1000 x 1400 x 1650 mm TR7007Q Plus DL: 1000 x 1500 x 1650 mm TR7007LQ Plus: 1365 x 1720 x 1710 mm Note: not including signal tower, signal tower height 515 mm
Weight	TR7007Q Plus: 750 kg TR7007Q Plus DL: 830 kg TR7007LQ Plus: 982 kg

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